Motorola MC68306 Bedienungsanleitung Seite 42

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Seitenansicht 41
MOTOROLA 68K and ColdFire Product Portfolio Overview 35
XC68LC060, Continued
Related
Documentation
Support Tools M68EC060IDP–An integrated development platform and hardware/
software evaluation module that will be available soon. Refer to The
High Performance Embedded Systems Source Catalog for third-party
support tools.
Support Chips • MC68150–Dynamic bus sizer
• MC88926–Clock driver
• Crystals–Champion, Kyocera, and ACT
• FSRAMS–MCM62940 and MCM69P818ZP burst-mode SRAMs
Package and Speed
Options
Product History
Status Information First Silicon: 4Q93
XC Qualification Date: 1Q95
Die Size: 103.2 mm
2
Devices: Active = 2,130,000
Process:.42m
HCMOS
TITLE
ORDER NUMBER
MC68060 Product Brief
MC68060/D
M68060 User’s Manual (Rev 1)
M68060UM/AD
M68060 Family Brochure
BR1153/D
The High Performance Embedded Systems
Source Catalog
BR729/D
DEVICE
PACKAGE SPEED REV TEMP
ORDER QUANTITY
FOR SAMPLE
ORDER
SOQ MPQ POQ
XC68LC060
206-Lead RC 50-MHz 0 1 10
MASK REV SHRINK FAB GEO STATUS ERRATA PCN COMMENTS
1F43G C 85% MOS11 0.5m Production Yes
0F43G B 85% MOS11 0.5m Cancelled Yes
D11W A 85% APRDL 0.5m Cancelled Yes
LC060s temp. sourced from full
060 mask
Seitenansicht 41
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